期刊名称:ULTRAMICROSCOPY

ISSN:0304-3991
版本:SCI-CDE
出版频率:Monthly
出版社:ELSEVIER, RADARWEG 29, AMSTERDAM, NETHERLANDS, 1043 NX
  出版社网址:http://www.elsevier.nl/
影响因子:2.689
主题范畴:MICROSCOPY

期刊简介(About the journal)    投稿须知(Instructions to Authors)    编辑部信息(Editorial Board)   



About the journal

 

ULTRAMICROSCOPY

 

Scientists engaged in ultrastructure research seem to fall into two overlapping categories. One group uses existing tools and methods to advance knowledge in particular disciplines. The second group is committed to advancing the tools and methods themselves. For the benefit of both groups, this work finds its outlet in Ultramicroscopy, a journal initiated to provide a forum for investigators and to concentrate otherwise widely dispersed knowledge, promoting cross-fertilization between the two groups. This communication between

 

developer and user covers all aspects - fundamental and technical - pertaining to ultramicroscopic elucidation of structure, ranging from particle optics to radiation interaction.

 


Instructions to Authors

 

Submission of papers
Original material. Submission of a manuscript implies it is not being simultaneously considered for publication elsewhere and that the authors have obtained the necessary authority for publication.
Refereeing. Authors should supply names, addresses and e-mail addresses of three referees who will, if appropriate, be acknowledged in the printed articles, as in the case of any other colleague who improves the paper with constructive criticism.

Types of contributions
Original research papers and Ultramicroscopy Reviews should contain an Abstract (of up to 200 words) and a Conclusion section, which particularly in the case of theoretical papers translates the results into terms readily accessible to most readers. Reviews are longer papers for which key researchers are invited to contribute a timely appraisal of developing techniques and methods in their field.

Manuscript preparation
All manuscripts should be written in good English.
Structure. Please adhere to the following order of presentation: Article title, Author(s), Affiliation(s), Abstract, PACS codes and keywords, Main text, Conclusions, Acknowledgements, Appendices, References, Figure captions, Tables.
Corresponding author. The name, complete postal address, telephone and fax numbers and the e-mail address of the corresponding author should be given on the first page of the manuscript.
PACS codes/keywords. Please supply for indexing purposes 1-4 relevant PACS-1996 classification codes and 1-4 keywords from the Subject Guide to be published in the last issue of every volume.
References. References to other work should be consecutively numbered in the text using square brackets and listed by number in the Reference list. Please refer to a recent issue of Ultramicroscopy for examples.

Manuscript submission

Web submission
In order to facilitate a rapid refereeing process and a shorter time to publication, authors are strongly encouraged to submit manuscripts electronically using the Elsevier Author Gateway. Full instructions on web submission can be found at http://www.authors.elsevier.com.

Paper submission
Ultramicroscopy will still accept paper copies of manuscripts. These should be prepared with double line spacing and wide margins on numbered sheets. Paper manuscripts (one original + two copies) plus an electronic version (on disk) should be sent to:

Dr P.A. Midgley,
Editor, Ultramicroscopy,
Department of Materials Science and Metallurgy,
University of Cambridge,
Pembroke Street,
Cambridge, CB2 3QZ.
United Kingdom.

E-mail: ultram@msm.cam.ac.uk
Fax: +44 1223 363 943

Illustrations should also be submitted in triplicate: one master set and two sets of copies. The line drawings in the master set should be original laser printer or plotter output or drawn in black india ink, with careful lettering, large enough (3-5 mm) to remain legible after reduction for printing. The photographs should be originals, with somewhat more contrast than is required in the printed version. They should be unmounted unless part of a composite figure. Any scale markers should be inserted on the photograph itself, not drawn below it.

Cover Illustration
Authors are encouraged to submit to the Editor one of the figures from their manuscript as a separate file for consideration as the illustration for the front cover of Ultramicroscopy. Figures should be either square or in landscape format with a horizontal: vertical ratio of no greater than 1.3.

Colour plates
Figures may be published in colour, if this is judged essential by the Editor. The Publisher and the author will each bear part of the extra costs involved. Further information is available from the Publisher.

After acceptance
Notification. You will be notified by the Editor of the journal of the acceptance of your article. If there is not already a copy of the electronic version (on disk) with the journal editor at the time of being refereed, you will be asked to send a file with the text of the accepted manuscript directly to the Publisher at the Elsevier address given below. Please note that no deviations from the version accepted by the Editor of the journal are permissible without the prior and explicit approval of the Editor. Such changes should be clearly indicated on an accompanying printout of the file.
Copyright transfer. Authors will be asked to transfer the copyright of the article to the Publisher. This transfer will ensure the widest possible dissemination of information.
Proofs. At the proof stage only printer's errors may be corrected. No changes in, or additions to, the edited manuscript will be accepted.

Author benefits
No page charges. Publishing in Ultramicroscopy is free.
Free offprints. The corresponding author will receive 25 offprints free of charge. An offprint order form will be supplied by the Publisher for ordering any additional paid offprints.
Discount. Contributors to Elsevier Science journals are entitled to a 30% discount on all Elsevier Science books.

Author Enquiries
For enquiries relating to the submission of articles (including web submission) please visit the Author Gateway from Elsevier at http://www.authors.elsevier.com. The Author Gateway also provides the facility to track accepted articles and set up e-mail alerts to inform you of when an article's status has changed, as well as detailed artwork guidelines, copyright information, frequently asked questions and more.

Contact details for questions arising after acceptance of an article, especially those relating to proofs, are provided after registration of an article for publication.

and methods to advance knowledge in particular disciplines. The second group is committed to advancing the tools and methods themselves. For the benefit of both groups, this work finds its outlet in Ultramicroscopy, a journal initiated to provide a forum for investigators and to concentrate otherwise widely dispersed knowledge, promoting cross-fertilization between the two groups. This communication between developer and user covers all aspects - fundamental and technical - pertaining to ultramicroscopic elucidation of structure, ranging from particle optics to radiation interaction.

 


Editorial Board

 

Editor:

P. Midgley, University of Cambridge, Department of Materials Science and Metallurgy, Pembroke Street, Cambridge CB2 3QZ, United Kingdom Email: ultram@msm.cam.ac.uk

Associate Editor (for scanning probe microscopy):

S.M. Lindsay, Arizona State University, Tempe, AZ 85287, USA Email: stuart.lindsay@asu.edu

Editorial Board:

W. Baumeister, Martinsried bei M¨¹nchen, Germany
A. Cerezo, Oxford, UK
J.-P. Chevalier, Virty-sur-Seine Cedex, France
D.J.H. Cockayne, Oxford, UK
A.G. Cullis, Sheffield, UK
U. Dahmen, Berkeley, CA, USA
K.H. Downing, Berkeley, CA, USA
R.F. Egerton, Edmonton, Alb., Canada
A. Engel, Basel, Switzerland
J. Frank, Albany, NY, USA
H.-J. G
¨¹
ntherodt, Basel, Switzerland
P. Hawkes, Toulouse Cedex, France
S. Ijima, Tsukuba, Japan
C. Jacobsen, Stony Brook, NY, USA
H. Kohl, M
¨¹
nster, Germany
R. Leapman, Bethesda, MD, USA
D. Muller, Muray Hill, NJ, USA
L.-M. Peng, Beijing, China
G. Pozzi, Bologna, Italy
M. Radmacher, Göttingen, Germany
M. R
¨¹
hle, Stuttgart, Germany
D.J. Smith, Tempe, AZ, USA
J.C.H. Spence, Tempe, AZ, USA
R. Sperling, Jerusalem, Israel
K. Takayanagi, Yokohama, Japan
A. Tonomura, Hatoyama, Japan
D. Van Dyck, Antwerp, Belgium
R. Vincent, Bristol, UK
M.E Welland, Cambridge, UK
M.J. Witcomb, Johannesburg, South Africa
H.W. Zandbergen, Delft, The Netherlands

 

 

 


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